Electrical performance of assemblies
Packaging des circuits intégrés

Electrical signals propagate from one integrated circuit to another, passing through the various levels of packaging. The design of a package, module or board does not stop with the layout of the links: the dimensioning of interconnections must also take into account their electrical behavior. Specific modeling software can be used to determine the electrical characteristics of lines, and is increasingly integrated with assembly layout software. All the concepts covered in this chapter are detailed in the article [E 3 455]...