Interconnection Technologies
Optical Interconnects - Technologies and applications

Despite the availability of optoelectronic sources and interfaces on the market, more than half of the development costs for interconnection modules are attributable to the assembly and encapsulation stages. An optoelectronic module is built around three main components:

• the “optical engine” or optical subassembly (OSA), which is responsible for aligning the optoelectronic components with the fibers or waveguides;

• the electronics, which must adapt external signals to the currents required by the light sources or convert photocurrents into voltages;

• the “packaging,” which ensures the mechanical integrity of the assembly and provides the electrical interface with the application.