Hybrid circuits — Manufacturing

The manufacture of hybrid printed circuit boards involves a wide variety of technologies, most of which have been around for many years.

While the principles are relatively easy to understand, their implementation for industrial production requires experience.

The various technologies described in this document can be classified into three categories corresponding to different professions:

• the manufacture of the substrate (slip, cofritting, etc.), which remains the domain of the ceramist;

• thin-film or thick-film metallized tracks;

• assembly and wiring of active and passive components.

Technical choices must take into account reliability, thermal performance and cost.