6. Wiring wire
The power module's internal electrical connections, on semiconductor chips in particular, are generally made using Wire Bonding technology. These are wiring wires with a diameter of between 100 and 500 μm (figure
20
a)
. They are generally made either of aluminum,...
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Wiring wire
Bibliography
Bibliography
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(1) - MASSON (A.), SABBAH (W.), RIVA (R.), BUTTAY (C.), AZZOPARDI (S.), MOREL (H.), PLANSON (D.), MEURET (R.) -
Die attach using silver sintering. Practical implementation and analysis.
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European Journal of Electrical Engineering, vol. 16, n° 13-14, p. 293-305, août 2013....
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