Applications of ALD
Atomic Layer Deposition (ALD)

The ALD deposition process, due to its ability to form dense, uniform layers of controlled thickness with precise control of stoichiometry regardless of the substrate type (fragile, flexible, smooth, rough, nanostructured, complex geometries, 3D structures, polymers, etc.) at relatively low temperatures (generally below 300 °C), is used in a very wide range of applications. Precise control of film thickness also enables the development of new strategies to modify the chemical or physical properties of nanoscale materials and to open up new synthesis pathways for novel nanostructures.

Figure 9 provides an overview of the main applications of ALD. Its scope of application, initially focused on microelectronics (pink area), has expanded into strategic fields: energy (green...