High-power pulsed cathodic sputtering
High Power Impulse Magnetron Sputtering

The synthesis of new materials on complex-shaped substrates and the improvement of the quality of existing films are the main motivations for the development of innovative power supplies.

One limitation of conventional cathodic sputtering is related to target cooling, since most of the electrical power is dissipated within the sputtering target as thermal energy following ion bombardment. HiPIMS technology makes it possible to generate very high instantaneous currents while maintaining low target heating, due to the use of short pulses, ranging from a few μs to a few hundred μs, with a low duty cycle, typically less than 10%. These short pulses also help maintain the discharge by reducing the creation of unwanted arcs if the pulse duration is...