Special application: the MID
Overmolding or overinjection

The MID (or Molded Interconnected Device) is a system that combines the processes of thermoplastic molding, activation and metallization, to produce 3D parts with both mechanical and electrical functions. These parts usually require a high degree of precision and the use of specific materials and methods.

MID is mainly used in the electronics, mechatronics, packaging and telephony industries, for antennas and coaxes...

We are generally involved in the manufacture of precision parts (1/1,000 or better) of small dimensions (from about a centimetre to less than a millimetre).