2. Bio-orientation without heat setting: shrink films
A limited number of processors worldwide possess this technology, and multiple patents cover the processes, especially when there is an improvement in the O2 barrier and the simultaneous use of irradiation (β or γ).
Note: Irradiation enhances thermal stability and puncture resistance by creating three-dimensional bonds.
2.1 With O2 barrier: presence of PVDC, EVOH, and/or PA
Double bubble technology is used (see figure 3 ); when irradiation occurs, the process is as shown in figure
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Bio-orientation without heat setting: shrink films
Coextruded films
Bibliography
- - Emballages Magazine http://www.emballagesmagazine.com/
Manufacturers
The table 1 provides references for...
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