Cyanide Alkaline Electrolyte for Copper Plating : Kinetic aspects

Kinetic aspects
Cyanide Alkaline Electrolyte for Copper Plating

Author : Jean-Claude CATONNÉ

Publication date: September 10, 2021 | Lire en français

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3. Kinetic aspects

Table 4 shows the kinetic parameter values for the Cu ⁺ /Cu system in cyanide medium. ${[Cu {(CN)}_{n + 1}]}^{n -} / Cu ↓$

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Kinetic aspects

(1) - HORNER (J.) - Cyanide Copper Plating. - Plating and Surface Finishing, vol. 89, n° 8, p. 28-30 (2001).
(2) - HOLT (D.A.) - Brevet d'invention 2255057, Dupont de Nemours (1941).
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