Depositing nanometric films by radio frequency cathodic sputtering

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Depositing nanometric films by radio frequency cathodic sputtering

Author : Gilles RENOU

Publication date: April 10, 2006 | Lire en français

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ABSTRACT

This article addresses the deposition of nanometric films by radiofrequency sputtering that, until recently, was reserved for use in the aeronautics and space fields. This process is now economically affordable for other industries as diverse as the decoration or biomedical sectors. Firstly, this article addresses low temperature and low pressure discharges: continuous discharge diodes and radio-frequency discharges (discharge excited by high-frequency electric fields). Following the deposition parameters are reviewed: spraying mechanisms, power, pressure as well as the target to substrate distance.

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 INTRODUCTION

The deposition of thin layers ranging from a few tens of nanometers to a few micrometers using physical vapor deposition (PVD) was once reserved for the aerospace industry. While this process is still widely used in mechanical engineering, it is now economically viable for other sectors as diverse as decoration and biomedicine. Most sputtering deposition machines operate using magnetron diodes. However, in certain cases, particularly when using insulating targets, the use of a radio frequency system is essential.

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