3. Interconnection technologies
Despite the availability of optoelectronic sources and interfaces on the market, more than half the development costs of interconnection modules are due to the assembly and encapsulation stages. A module can be broken down into two parts: the so-called passive technologies (at the electrical level), which include assembly and encapsulation as well as coupling optics, if any, and the active technologies, made up of optoelectronic interfaces.
3.1 Passive technologies
They include everything to do with the assembly and encapsulation of the module's various components. Traditionally, optoelectronic components are dynamically transferred, i.e. the assembly of the fibers facing the sources or photodetectors is adjusted in real time by controlling the coupled optical...
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Interconnection technologies
Research areas and long-term trends
Bibliography
Theoretical references
Theoretical optics
Conferences
Optical Fibre Communication : OFC
European Materials Research Society : E-MRS
Workshop on Optical Communications and Computer Sciences : WOCCS
Lasers and Electro-Optics Society : LEOS
Electronic Components and Technology Conference : ECTC
International Electronic Packaging Technical Conference : InterPack...
Standards and standardization bodies
In the field of optical interconnections, we find most of the standardization bodies in the world of electronics and microelectronics. Examples include :
Union technique de l'électricité (UTE);
International Electrotechnical Commission (IEC);
Laboratoire Central des Industries Electriques...
Financial organizations and players
Manufacturers, national governments and universities are all involved in the development of optical interconnections, over the longer or shorter term depending on the commercial or technological nature of their objectives. R&D is largely focused on the development of complete, integrated systems, using technological options and materials such as VCSELs for transmitters, fibers for box-to-box connectors,...
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