5. Glossary

Atomic diffusion bonding (ADB)

A promising process for bonding wafers at room temperature: thin films are sputtered onto two flat wafer surfaces, then the two films are bonded to the wafers in a vacuum. In addition to thin metal films, thin oxide and nitride films are useful for bonding.

Énergie d'adhésion ; Adhesion energy

Energy used to bring surfaces together.

Adherence energy; Énergie d'adhérence

Energy required to separate joined surfaces (also known as bonding energy).

DCB test; Double Cantilever Beam test

Test consisting in propagating a crack by pulling on both arms of a double beam to measure Mode I toughness.

Fizeau interferometer; Fizeau interferometer

Precision...