6. Interconnections and contact
Towards the end of the 1990s, aluminum was replaced by copper for the manufacture of metal interconnects, as the latter has a lower resistivity, allowing the electrical signal to propagate more rapidly through the circuit . Interconnections are formed by copper lines on different levels (up to 12), each level being connected by copper studs (figures
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Interconnections and contact
ALD chamber types and deposition speed
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