5. Thermal design guide
The reduction in the volume of electronics due to miniaturization – including the use of hybrid circuits – results in an increase in thermal density and limits thermal evacuation possibilities.
When designing a hybrid circuit, it is necessary to carry out a thermal analysis to ensure that the junction temperature of active pads and the package temperature of other microcomponents are not exceeded.
A few basic rules must be taken into account when designing a dissipative hybrid circuit:
You do not have access to this resource.
Exclusive to subscribers. 97% yet to be discovered!
Already subscribed?
Log in!
Ongoing reading
Thermal design guide