Glossary
Metallurgy for silicon-based microelectronics

top-down approach

In microelectronics, a top-down approach consisting of "sculpting" material using lithography/engraving processes to create miniature components.

bottom-up approach

In microelectronics, in contrast to the top-down approach, we use assembly at the atomic, molecular or supramolecular level to manufacture nano-objects used as components.

nano-object

Object with at least one of these dimensions on a nanometric scale of less than 100 nm (e.g. nanotubes, nanowires, nanoparticles, etc.).

packaging

Technology enabling several microelectronic components to be bonded together (wire bonding, etc.).

3D integration

Co-integration of different functions in the same...