Assembly and interconnection categories
Packaging and interconnection processes for electronics components

Circuit assembly is the first step after substrate fabrication and cutting. It is defined as the process of electrically connecting the chip's input/output (I/O) pads. Assembly consists of three parts:

• the chip's metal stud,

• a metal connecting element between the chip and its substrate,

• the metal stud on the package.

At the interface between chip and system, this assembly must meet five essential criteria:

• have "acceptable" electrical properties (in terms of capacitance, resistance and inductance),

• be a low-cost solution,

• be easy to industrialize and have a high manufacturing capacity,

• be reliable,...