Conclusion
Thermomechanical durability of lead-free electronic assemblies

Controlling the thermomechanical lifetime of solder joints is a major challenge for companies that manufacture or integrate critical electronic equipment used in harsh thermal environments, such as certain aerospace, military, space, and medical applications. Demonstrating the lifetime of such equipment requires the use of validated thermomechanical fatigue models.

This article has highlighted the complexity of electronic assemblies. These can consist of a multitude of electronic components with very varied compositions and using different types of materials (epoxy resin, silicon, metal alloys, etc.). The printed circuit board has a sandwich structure, alternating layers of copper conductors and composite layers with an organic matrix, comprising epoxy resin reinforced with fiberglass fabric. Finally, the solder alloy is a metallic material whose composition has...