Glossary
Packaging des circuits intégrés

ball

Bille.

bossages; bumps

A deposit that allows contact to be made with a ball.

bumping

boss.

chip ; die

Chip.

flip chip

Flip chip.

interpose

Intermediate chip used as a mechanical wedge or which can accommodate chips on either side and is fitted with through-holes.

electronic module

Several electronic components interconnected and assembled.

pillar bumps

Interconnections often surmounted by fusible material (usually copper) to ensure soldering.

remelting

Technical sequence...