Glossary
Packaging des circuits intégrés

ball

Bille.

bossages; bumps

A deposit that allows contact to be made with a ball.

bumping

boss.

chip ; die

Chip.

flip chip

Flip chip.

interpose

Intermediate chip used as a mechanical wedge or which can accommodate chips on either side and is fitted with through-holes.

electronic module

Several electronic components interconnected and assembled.

pillar bumps

Interconnections often surmounted by fusible material (usually copper) to ensure soldering.

remelting

Technical sequence that involves melting the fusible balls when the chips are assembled.

sell bump

Embossing made with a fusible material.

stacking

Chip stacking.

stud bump

Gold bead ensures interconnection between 2 studs.

tap

Film.

via

Electrical connection...