Glossary
Packaging and interconnection processes for electronics components

ball :

Bille.

bump:

Bosses that allow contact to be made with a ball.

bonding :

Gluing.

chip :

Chip.

copper pillar :

Copper interconnection often topped with fusible material for brazing.

dicing :

Sawing, chip cutting.

Embedded :

Embedded, buried.

Packaging:

Encapsulation.

flip chip :

Flip chip.

FR4 :

Material used to manufacture CIs.

I/O :

Electrical chip input and output terminals.

interposer :

Intermediate chip that can accommodate chips on either side, with through vias.

LCP :

Alternative to polyimide films for flexible substrates.

LTCC :

Multi-layer glass-ceramic substrate.

electronic module :