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Ongoing reading
Methods used
Bibliography
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(1) - FRANKE (J.) - Three-Dimensional Molded Interconnect Devices (3D-MID) Materials, Manufacturing, Assembly, and Applications for Injection Molded Circuit Carriers. - Hanser Publications (2014).
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(2) - LPKF - Three-Dimensional Circuits – LPKF LDS : Laser Direct...
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