Conclusion
Optoelectronic packaging for fiber optic devices

The evolution of modules used in optical networks, whether long- or short-range, is following a proven roadmap, based on higher data rates per module and greater compactness. Taking these two trends into account is enough to predict the growing importance of integrated solutions, combining several optical functions (photodetection, modulation, multiplexing), associated control electronics (modulator drivers, amplifiers, etc.) and, potentially, electronic logic functions obtained using CMOS technology, in a single module (System-In-Package ) or even on a single chip (System-On-Chip ). It is therefore certain that the packaging of electronic modules will converge towards the packaging of advanced microelectronic components. On the other hand, this evolution will require us to address the essential issue of coupling light to the outside of the module, using technologies that are as inexpensive...