Analysis method for printed circuit boards subjected to environmental vibrations

Since the 1960s, electronic components have become increasingly miniaturized. New assembly techniques have emerged, such as surface mounting, considerably reducing the amount of solder used to hold components in place.

However, these new technologies have also led to a significant reduction in the shock and vibration resistance of assembled electronic boards, forcing designers to carry out a new phase of study, dedicated to the vibratory behavior of their products. We find this stage in the aeronautics industry, for example, where vibrations caused by air friction can have extremely dangerous effects, and must be taken into account right from the start of a project.

This article presents a method for analyzing the vibration resistance of electronic boards and their components, enabling a rapid estimate of the risk of fatigue failure. These results are of particular interest before carrying out a finite element calculation, a more accurate method but also more costly in terms of time and material resources.

We approach this problem by first reviewing general notions of vibration mechanics, then studying the vibration response of electronic boards (modeled by plates), and finally analyzing the effect of electronic board deformations on their components, and how to calculate their lifetime.

A table summarizing the classic results is provided for the reader, who can also complete his study by consulting the works listed in the bibliography for more complex systems.