2. Bio-orientation without heat setting: shrink films
A limited number of processors worldwide possess this technology, and multiple patents cover the processes, especially when there is an improvement in the O 2 barrier and the simultaneous use of irradiation (β or γ).
Note: Irradiation enhances thermal stability and puncture resistance by creating three-dimensional bonds.
2.1 With O2 barrier: presence of PVDC, EVOH, and/or PA
Double bubble technology is used (see figure 3 ); when irradiation...
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Bio-orientation without heat setting: shrink films
Coextruded films
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