Technological innovations

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12-month license

Technological innovations

Your technology watch to identify tomorrow's industrial challenges

Add to my library

From 1479 € excl. VAT

12-month license

Major R&D projects and innovations, technological trends, sectoral studies and forward-looking analyses: a compendium of intelligence, essential for nurturing an innovation strategy
A key factor in economic development, innovation is more than ever at the heart of companies' concerns. It is an essential lever for long-term growth, enabling companies to face up to the crisis and global competition. It also plays a crucial role in differentiating a company from others, adapting to market needs and continuing to win over customers.

The year's major events

View 14 articles

Major innovations

View 10 articles

Innovations in energy

View 30 articles

Environmental innovations

View 19 articles

Innovations in advanced materials

View 38 articles

Innovations in analysis and measurement

View 43 articles

Analysis in materials and chemistry

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Innovations in electronics and ICT

View 40 articles

Optoelectronics and light-emitting diodes

[Archives] Technological innovations

View 13 articles

The latest publications in this offer are:

  • RE282
    ALD for the electrochemical stockage of energy

    Given the limitations of lithium-ion batteries (cost, safety, resources), new technologies such as all-solid-state or sodium-based batteries are currently being researched. Their performance depends heavily on the quality of the electrode-electrolyte interfaces. Atomic layer deposition (ALD) enables the creation of ultra-thin, uniform coatings on complex surfaces, thereby improving electrode protection, performance and battery lifespan. This technique, therefore, appears to be a promising solution for next-generation batteries.

  • RE264
    Area Selective Deposition - ASD

    Area Selective Deposition is a technique that allows a material to be deposited only on specific areas of a substrate, without the need for photolithography or etching steps. It fundamentally relies on a contrast in surface reactivity, which prevents growth where it is not desired while allowing it where it is wanted, using an atomic layer deposition process. On a substrate, the inherent reactivity contrast is typically weak, and it can be enhanced either by activating or by deactivating the surface in order to either promote or block the growth, respectively.

  • RE261
    Environmental barriers by ALD

    Environmental barrier coatings are thin films or multilayer structures that limit mass transfer between a material and its environment, reducing gas penetration (water vapor, oxygen, CO₂) or preventing loss of volatile compounds. They are critical for product performance, durability, and reliability in applications ranging from food packaging to advanced electronics. Atomic Layer Deposition (ALD) is a key technology for such coatings, enabling highly uniform, conformal, and dense films with precise nanometer-scale thickness control through self-limiting surface reactions. These ALD layers provide strong barrier properties even at very low thicknesses and can be deposited at low temperature on sensitive substrates. Applications include microelectronics, OLEDs, photovoltaics, and packaging.

  • RE257
    Atomic layer deposition for photovoltaics

    This article presents the applications of Atomic Layer Deposition (ALD) in the field of photovoltaics (PV). After a brief overview of PV conversion, the main PV technologies and their challenges, the specific features of the ALD technique will be detailed, highlighting its assets for PV, such as the ability to deposit uniform, conformal thin films with atomic-scale control over thickness and film composition under mild conditions. Finally, a selection of application examples is presented to illustrate these benefits, as well as the associated challenges and limitations.

  • RE255
    ALD in Microelectronics devices - Evolution and Use in Advanced Micro-Devices

    Atomic Layer Deposition (ALD) is a thin-film deposition technique with atomic precision widely used in electronics and microelectronics. This method enables precise control of film thickness and composition, which is crucial for manufacturing advanced electronic devices. ALD is valued for its conformality, meaning its ability to uniformly coat substrates with complex geometries, including 3D structures. This document highlights two main applications: the fabrication of advanced FDSOI and FinFET transistor gates, and recent advances in ferroelectric memories.

  • IN100
    Low-cost impedance spectrometer for characterizing electrochemical devices

    Electrochemical impedance spectroscopy (EIS) can reveal the internal physical processes of a system. For this reason, it has become a powerful diagnostic and characterization technique for electrochemical energy conversion and storage devices, including hydrogen systems WANG (H.), GAILLARD (A.), HISSEL (D.), batteries SHA (J.), LI (X.), QIU (G.), and photovoltaic (PV) systems WANG (X.), ZHENG (Z.), AILLERIE (M.), PERA (M.-C.), HISSEL (D.). By applying small electrical disturbances and analyzing the voltage-current response over a predefined frequency range, one can obtain the system’s EIS, which provides relevant information about these internal dynamic processes.

  • IA1040
    Deploying Trustworthy AI for Industrial Maintenance

    The article [IA 3020] laid the foundations: architecture, business-oriented KPIs and calibrated abstention policy. This article details thehow, presenting a five-step methodology : operational-domain scoping, documentary governance, agentic design, integration-verification-validation-qualification (IVVQ), operational maintenance, punctuated by four decision gates (W0 through W3) each requiring measurable evidence for progression. An end-to-end illustrative scenario demonstrates how these principles translate into concrete deliverables and quantifiable outcomes. The mapping to the Confiance.ai Body of Knowledge and the EU AI Act facilitates dialogue with quality departments and regulatory authorities.

  • RE253
    Atomic Layer Deposition (ALD)

    This article presents the principles of the chemical vapor deposition method based on alternating precursor pulses, known as Atomic Layer Deposition (ALD). The discussion covers the range of materials that can be synthesized using this technique, its environmental impact, and its various fields of application together with their recent developments. Finally, a practical description of the steps involved in implementing an ALD process is provided.

  • RE283 Reviewed
    New approach of H-embrittlement - Degassing and hydrogenation

    H-embrittlement remains a problem for mechanical industries. Despite “degassing” heat treatment specifications and standards to avoid time-dependent rupture for quench/temper steel. The minimal heat treatment time depends only on the mechanical strength. The persistence of the problem, it means that the mechanism to avoid the H-embrittlement is not clear. The assumption that the degassing heat treatment might increase the hydrogen amount in the steel matrix is further explore. This article’s objective is to develop a new approach of the heat treatment function.

  • IN222
    Electrostatic impregnation process developed by Fibroline

    For more thantwenty years, Fibroline has been developing several patented technologies for electrostatic impregnation. These technologies allow to impregnate in a dry way, without water nor solvent, a great variety of powders in porous substrates such as nonwoven, textile, foam, paper, yarn or roving. This article begins with the presentation of the principle of Fibroline’s dry impregnation technology, the characteristics of the materials used as well as the various technological configurations developed around this principle. The transfer to industrial scale is then detailed considering the technical, economic and environmental benefits. Finally, examples of applications are presented for different industrial fields.

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