Conceptually, atomic layer deposition (ALD) drastically reduces the complexity of chemical processes during fabrication compared to CVD/MOCVD by eliminating gas-phase reactions and favoring a (quasi) single, self-limiting reaction at the substrate surface. This apparent simplicity has made ALD an ideal playground for theoretical research. Since the early 2000s, the use of modeling has continued to expand, both in terms of the techniques employed and the applications targeted by ALD-based processes.
At small scales (of time and space), where intermolecular and molecule-surface chemical reactions occur, first-principles calculations have naturally become the standard, primarily through density functional theory (DFT). These are now complemented by reactive molecular dynamics simulations. These simulations provide essential insights into the chemistry of interactions (reaction pathways and activation barriers), the collective aspects of these mechanisms, layer growth rates, and so on.
At the mesoscale, kinetic Monte Carlo models have been proposed to study the formation of interfaces between heterogeneous materials in direct relation to the technological parameters of the deposition process (duration of ALD half-cycles, partial pressures)