System damage
Analysis method for printed circuit boards subjected to environmental vibrations
Article REF: E3954 V1
System damage
Analysis method for printed circuit boards subjected to environmental vibrations

Author : Maxime ALAY-EDDINE

Publication date: November 10, 2013, Review date: February 2, 2017 | Lire en français

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

3. System damage

In this section, we'll look at the relative displacement between a board and a component assembled on it, and then see how this phenomenon can produce breaks.

3.1 Relative displacement between an electronic board and a component

Let δ be the maximum relative displacement between a component and the electronic board on which it is mounted. Figures 4 a and b show the two possible configurations, depending on whether or not the component is centered on the board.

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Article included in this offer

"Electronics"

( 262 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details