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This paper intends to provide the keys to understanding silicon MOS (Metal-Oxide-Semiconductor) transistor operation, including process, advantages and limitations. After an introduction on MOS device structure and on how an MOS capacitor functions, transistor electrical characteristics will be described, to get a handle on the different operating regimes. A special focus will be made on the performance evaluation and optimization description, while linking it to the technological development roadmap and its associated limitations. Conventional bulk MOS transistor structure evolution and its scaling will be described up to the introduction of new transistor structures that are mandatory to continue to follow Moore’s law.
Dielectric resonators are non-conductive high permittivity ceramic objects, used to replace microwave cavities and reduce their size. They confine electromagnetic waves with up to 95% of their energy, through the TE01d mode of resonance. That article introduces the RLC resonant circuit, the microwave resonant cavity and the different coupling modes within the resonators. The quality factor of the cavities and dielectric resonators is obtained with resonance linewidth measurements of filters in transmission or absorption mode. Other ways of loading the cavity allow volume reduction of filters or access to higher frequencies. See for example the TM, HEM, TEM or gallery mode.
Dielectric resonators (DR) are central and basic elements in microwaves circuits with, for example, filters or oscillators. In this article, we will first describe how to measure the most important parameters for DR (permittivity, quality factor and thermal stability) as well as the elaboration process of the dielectric ceramic parts. Then will be presented some selection criteria to pick a DR and some market references. In a third part, we will introduce the physical origin and meaning of the permittivity of the material, followed by a non-exhaustive list of dielectric materials and their properties and chemical diagrams.
This article presents microwave receivers based on compact, ultra-sensitive vector magnetic field detectors, i.e. Josephson arrays. Because their implementation is easier and therefore economically more relevant, this article mainly deals with critical high temperature superconductors. The theoretical performance and experimental results are very attractive regarding dynamics and sensitivity. The removal of identified technological barriers will likely broaden the application domain. This concerns in particular the reduction of the dispersion of the Josephson junctions’ electronic characteristics and the choice of the architecture of two-dimensional networks.
This article concerns ceramic capacitors, passive components used in every domain of electronics. Their electrical performance and properties depend on their manufacturing technology and on the nature of their dielectric and metal materials. Choice of capacitor type depends on the desired application. It must take into account the value of the desired capacitance and the behavior of the dielectric according to the conditions of use. Implementation and bonding technologies together with reliability and cost constraints are other choice factors to consider.
Embedded electronic boards are subjected to severe thermal environments, particularly in the aerospace, military, and space sectors. Temperature variations induce thermomechanical stresses in solder joints, leading to fatigue cracking. This article presents a comprehensive methodology for assessing the durability of such assemblies: microstructural analysis of solder joints, material characterization, and statistical lifetime modeling, including both analytical and numerical approaches.
HF-guiding structures connect the components of a system or supply the power. Various techniques have been developed to design guiding structures and obtain the best performances. However, the technical implementation depends on their application and frequency. In this article, various processes to implement components in planar, multilayer technologies and additive manufacturing are presented. Then, the concept of a multi-port device scattering matrix that is used for computer-aided design is addressed. Furthermore, performances such as attenuation and power-handling capacity of several guiding structures are discussed. Finally, some applications and future developments are presented.
The purpose of this paper is to provide a comprehensive review of methodologies for electromagnetic compatibility (EMC) in system development. The proposed approach is structured around key steps that enable the identification of EMC risks through preventive analysis and their systematic mitigation throughout the development lifecycle.Established design best practices, particularly regarding interactions with mechanical constraints and PCB layout are examined, with the objective of minimizing the likelihood of critical design errors.
Microsystems are intelligent miniaturized multifunctional devices that combine mechanical, optical, electromagnetic, thermal or fluidic elements with on-board electronics. They can play the role of sensors, identifying the physical parameters of their environment (pressure, acceleration, temperature, etc.), or the role of actuators acting on that environment.This article describes microsystems, from the essential definitions to the main applications, while detailing the main categories of devices including their real implementation.
Reliability requirements for equipment in the space sector are extremely high. Traditional reliability calculation methods apply a uniform failure rate to all components, without considering the actual impact of each failure. This article presents an optimization approach that focuses only on critical failures, excluding those with minor or tolerable effects on the system. Based on functional analysis and failure modes, this method provides a more accurate representation of effective equipment reliability, while reducing overdesign and optimizing cost and onboard mass.
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