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Embedded electronic boards are subjected to severe thermal environments, particularly in the aerospace, military, and space sectors. Temperature variations induce thermomechanical stresses in solder joints, leading to fatigue cracking. This article presents a comprehensive methodology for assessing the durability of such assemblies: microstructural analysis of solder joints, material characterization, and statistical lifetime modeling, including both analytical and numerical approaches.
HF-guiding structures connect the components of a system or supply the power. Various techniques have been developed to design guiding structures and obtain the best performances. However, the technical implementation depends on their application and frequency. In this article, various processes to implement components in planar, multilayer technologies and additive manufacturing are presented. Then, the concept of a multi-port device scattering matrix that is used for computer-aided design is addressed. Furthermore, performances such as attenuation and power-handling capacity of several guiding structures are discussed. Finally, some applications and future developments are presented.
The purpose of this paper is to provide a comprehensive review of methodologies for electromagnetic compatibility (EMC) in system development. The proposed approach is structured around key steps that enable the identification of EMC risks through preventive analysis and their systematic mitigation throughout the development lifecycle.Established design best practices, particularly regarding interactions with mechanical constraints and PCB layout are examined, with the objective of minimizing the likelihood of critical design errors.
Microsystems are intelligent miniaturized multifunctional devices that combine mechanical, optical, electromagnetic, thermal or fluidic elements with on-board electronics. They can play the role of sensors, identifying the physical parameters of their environment (pressure, acceleration, temperature, etc.), or the role of actuators acting on that environment.This article describes microsystems, from the essential definitions to the main applications, while detailing the main categories of devices including their real implementation.
Reliability requirements for equipment in the space sector are extremely high. Traditional reliability calculation methods apply a uniform failure rate to all components, without considering the actual impact of each failure. This article presents an optimization approach that focuses only on critical failures, excluding those with minor or tolerable effects on the system. Based on functional analysis and failure modes, this method provides a more accurate representation of effective equipment reliability, while reducing overdesign and optimizing cost and onboard mass.
Voltage amplification is essential when they are barely perceptible. The most popular electronic voltage amplification circuits are made using operational amplifier (op-amp). This article addresses the basic concepts of voltage amplification and the operation of the op-amp, of which an idealized model is introduced. It presents the characteristics of elementary voltage amplification circuits and emphasizes the issues of choice of power supply, behavior depending on frequency and noise. It also shows that depending on the desired degree of precision, it is necessary to consider some imperfections of the op-amp.
Holography creates a three-dimensional image of an object. Originally invented in optics, this technique was later transposed to microwaves using technologies from radar and telecommunications. This article presents the principles and applications of microwave holography. Coherent and incoherent holography are first introduced. The various applications, ranging from terrestrial and space radar imaging to telecommunications and holographic data recording, are then detailed.
This article deals with electromagnetic compatibility (EMC) measurements carried out as part of EMC tests on electronic equipment. This field is partly based on the physics of electromagnetism. However, electromagnetic fields are not directly measurable. Electromagnetic field metrology is therefore a complex science in which the subtle relationship between fields and electronics must be mastered. This article sets out the steps and best practices for reducing the uncertainties associated with these tests.
This article discusses the origin of the microsystem concept from microelectronics, and the developments from its beginnings to recent applications around connected and smart sensor network systems. After a few definitions, the methods for designing a microsystem are given, using the typical example of the micro-cantilever. The operating principles in sensor or actuator modes are presented and illustrated with examples. Next, the manufacturing technologies are described, with particular emphasis on the mechanical-electronic coupling of the MEMS devices, including interconnection and packaging issues.
Acoustic wave transducers are considered as short range RADAR cooperative targets for probing through a radiofrequency link passive sensor responses. A systems engineering approach is needed to consistently address the whole measurement chain as described in this article : target design in order to delay the sensor response beyond clutter ; physical quantity measurement through a resonance frequency or echo delay introduced by the sensing mechanism ; short range RADAR implementation and associated signal processing schemes ; and finally sensor design including a clever selection of the piezoelectric substrate. Application examples are given at the end of the presentation.
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