Thermal issues in electronic systems
Cooling of electronics by liquid-vapour phase change
Article REF: E3955 V1
Thermal issues in electronic systems
Cooling of electronics by liquid-vapour phase change

Authors : Jocelyn BONJOUR, Frédéric LEFEVRE, Valérie SARTRE, Bruno ALLARD

Publication date: June 10, 2023 | Lire en français

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1. Thermal issues in electronic systems

Components, whether active or passive, dissipate heat as they operate within electronic systems. Components associated with electronic functions supplying energy to external systems are in fact the most exposed to heat dissipation. Examples include power amplification within wireless radio functions (antenna power supply) or, more generally, power supply functions for systems or within systems (battery charger).

At low power levels [E 3 952] , or for noise reasons, a power supply can be based on a linear approach. In this case, heat dissipation is moderate, since...

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