6. Glossary

planar technology

Process for implementing circuits on flat substrates. The lines are deposited or etched onto the surface of the substrate. In the case of multilayer substrates, different substrates are stacked and the lines deposited on the interfaces can be connected by metallized holes (vias). The structure may or may not be equipped with a metal base plane.

metallization

Process for adding metal to or through substrates. For example, electroplating, copper foil bonding (lamination by heating and pressing), cathodic spraying and painting (on foam substrates, for example).

screen printing

A process that involves mechanically spreading pastes for dielectrics or inks for conductors in a planar geometry, which may be multi-layered. After each layer, firing at 900°C...