Conclusion
MMIC : devices and technologies. Passive components

Article REF: E1427 V2

Conclusion
MMIC : devices and technologies. Passive components

Authors : Gilles DAMBRINE, Didier BELOT, Pascal CHEVALIER

Publication date: November 10, 2015 | Lire en français

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3. Conclusion

This article describes the main passive elements found in high-frequency integrated circuits, and more specifically in III-V MMICs.

Although the description of the principle and electrical modeling of these passive components in this article provide a good basis for approaching the case of silicon MMICs, the reader is advised to take into account the specific technological features of these silicon systems.

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Bibliography

(1) - CASTAGNÉ (C.), DUCHEMIN (J.-P.), GLOANEC (M.), RUMELHARD (Ch.) - Circuits intégrés en arséniure de gallium, - Masson (1989).
(2) - GUPTA (K.C.), GARG (R.), BAHL (I.), BHARTIA (P.) - Microstrip lines and slot lines (Lignes microstrip et lignes...

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