5. Conclusion

The encapsulation of air-sensitive electronic devices using organic or inorganic semiconductors is a booming technology today. However, few high-performance technologies exist at present, with the exception of the BarixTM solution initially implemented in the USA and recently acquired by Samsung. Other solutions have since been proposed, but it would appear that ALD technology is the preferred solution, not least because it enables barrier films to be deposited relatively easily without pinholes. However, the film thicknesses used are low, and do not allow us to avoid extrinsic defects (particles) present on the surface of the devices to be protected. Ultimately, the development of robust encapsulation requires, at the very least, the use of a technology such as ALD, but it must be coupled with control of the external environment, in order to produce barrier layers on healthy, defect-free...