Conclusion
Optoelectronic packaging for fiber optic devices
Article REF: E4550 V2
Conclusion
Optoelectronic packaging for fiber optic devices

Authors : Stéphane BERNABÉ, Christophe KOPP

Publication date: July 10, 2014, Review date: June 19, 2017 | Lire en français

Logo Techniques de l'Ingenieur You do not have access to this resource.
Request your free trial access! Free trial

Already subscribed?

4. Conclusion

The evolution of modules used in optical networks, whether long- or short-range, is following a proven roadmap, based on higher data rates per module and greater compactness. Taking these two trends into account is enough to predict the growing importance of integrated solutions, combining several optical functions (photodetection, modulation, multiplexing), associated control electronics (modulator drivers, amplifiers, etc.) and, potentially, electronic logic functions obtained using CMOS technology, in a single module (System-In-Package ) or even on a single chip (System-On-Chip ). It is therefore certain that the packaging of electronic modules will converge towards the packaging of advanced microelectronic components. On the other hand, this evolution will require us to address the essential issue of coupling light to the outside of the module, using technologies that are as inexpensive...

You do not have access to this resource.
Logo Techniques de l'Ingenieur

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource. Click here to request your free trial access!

Already subscribed?


Article included in this offer

"Optics and photonics"

( 202 articles )

Complete knowledge base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

View offer details