3. Optical packaging technologies

Since the early 1990s, packaging has become a subject of study in its own right, requiring its consideration right from the design phase. Indeed, the evolution of electronic circuits requires packaging to cope with, and participate in, the increasing density of electrical interconnections, signal frequencies and heat densities to be dissipated.

Optoelectronics adds new constraints, such as thermal management that can be regulated down to 1/10th of a degree to ensure spectral adjustment, and above all optical coupling with a guide or fiber, generally single-mode, requiring alignment of submicron precision and stability.

In this way, optoelectronics introduces criticality into the component assembly phase, with a higher level of requirement for electronic components.

This section describes optical packaging technologies,...