6. Conclusion

Silicon photonics technology has become an industrial reality, with commercial products based on manufacturing centers and design environments modelled on microelectronics methods. This platform has already entered a second stage of maturity, with the complexity and integration level of photonic circuits increasing from a few dozen to several hundred functions per chip, particularly for optical routing arrays. The next major step remains the co-integration of laser sources, which has only been demonstrated for certain specific configurations. In the longer term, these high-speed optical transceiver solutions will be implemented for shorter-distance links, from intra-board connections for communications between processor and memory, to intra-chip connections for communications between computing cores on the same processor chip.