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Bipolar high-power impulse magnetron sputtering

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IN251 V1 Research and innovation

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Bipolar high-power impulse magnetron sputtering

Authors : Matthieu MICHIELS, Stephanos KONSTANTINIDIS, Dominique DECKERS

Publication date: September 10, 2023 | Lire en français

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1. Context

During the sputtering process [IN 207] , positive plasma ions (e.g. Ar + ) are accelerated towards the negatively polarized cathode surface. Attached to the cathode is a target whose surface atoms are ejected as a result of ion bombardment. Sputtering of the target generates a vapour of metal atoms which condense on the surrounding surfaces, particularly the substrate. This process makes it possible to synthesize a very large number of materials in the form of thin films (< 1 μm), whether metals, alloys or compounds such as metal oxides, nitrides,...

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