6. Low sintering temperature Ni-Zn-Cu ferrites for integrated inductive components
The end of the 20th century saw a significant reduction in the size of semiconductor components (active components). Passive components, in particular inductive passive components (transformers, inductors), became the most voluminous. Their integration into electronic circuits (windings and magnetic cores) is now a priority. To achieve this, the co-sintering technique now seems unavoidable. Co-sintering consists in sintering together two materials of different natures, such as a ferrite with a conductive metal (metal tracks). This can be achieved using pure silver (melting temperature ) and low-temperature ferrites containing copper. Traditional ferrites have sintering temperatures that...
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Low sintering temperature Ni-Zn-Cu ferrites for integrated inductive components
Conclusion: future developments in soft ferrites for power electronics
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