Materials for microfluidics
Materials and microfluidics. Low temperature glass bonding : new opportunities

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Materials for microfluidics


Materials and microfluidics. Low temperature glass bonding : new opportunities

Authors : Grégory MARCH, Anne-Claire LOUËR, Guillaume DA ROLD, Clément NANTEUIL

Publication date: October 10, 2014, Review date: October 15, 2021 | Lire en français

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3. Materials for microfluidics

In this section, we present the materials currently most widely used in the manufacture of microfluidic devices, namely polymer materials and glass. Their main advantages, characteristics and limitations will be described, and we will focus more specifically on processes for sealing microfluidic chips, and in particular a low-temperature glass sealing process.

3.1 Polymer materials

Polymeric materials used in the manufacture of microfluidic devices can be divided into four categories:

  • elastomers such as PDMS;

  • photosensitive resins such as SU-8 ;

  • Thermoplastics such as PMMA, COC, COP, PS, PEEK ;

  • paper.

  • ...
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