Packaging electronics
Micro-electromechanical system sensors (MEMS) - Operating Principles
Article REF: R430 V1
Packaging electronics
Micro-electromechanical system sensors (MEMS) - Operating Principles

Authors : Gilles AMENDOLA, Patrick POULICHET, Laure SEVELY, Laurie VALBIN

Publication date: March 10, 2011 | Lire en français

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3. Packaging electronics

Micro-sensors, like their larger "cousins", require conditioning electronics. However, the difference in size often leads to a reduction in the variation of the quantities that can then be used to obtain an electrical signal. High-performance conditioning chains are therefore sometimes required to achieve good overall system sensitivities. Most of the time, the acquisition chain consists of a series of elements ranging from the sensor to the computer (see example in figure 38 ). Today, this type of architecture is enhanced by technologies (integrated circuit technology and MEMS technology) that enable the integration of many functions, including partial digital processing.

As one of the main benefits of MEMS sensors is their miniaturization, their often complex conditioning...

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