Second mode of action
INDAR process: disassembly of bonded structural assemblies
Research and innovation REF: IN72 V1
Second mode of action
INDAR process: disassembly of bonded structural assemblies

Authors : José ALCORTA,, Maxime OLIVE, Eric PAPON

Publication date: October 10, 2007 | Lire en français

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3. Second mode of action

3.1 Description

The first mechanism requires the migration of additives from solid to liquid. In the absence of a melting point (figure 8 ), however, it is possible to obtain a detachment mechanism based on the principle described in Part 1. In this case, decomposition takes place directly in the bulk of the material, and it is the gases that migrate to the interface, generating stresses that lead to net detachment of the substrates.

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