3. Conclusion
Since the first high-frequency integrated circuits based on III-V semiconductors appeared in the 1970s, MMICs have enjoyed a boom in terms of the diversity of technologies, including silicon, the complexity of the circuits/systems and their performance up to near THz. The 3D integration (SIP) of these circuits/systems, not covered in this article, with the combination of several dielectric and conductive materials is the subject of much development work.
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