3. Conclusion
Since the first high-frequency integrated circuits based on III-V semiconductors appeared in the 1970s, MMICs have experienced significant growth, both in terms of the diversity of technologies—including silicon—and in terms of the complexity of circuits and systems, as well as their performance up to the near-terahertz range. The 3D integration (SIP) of these circuits and systems—which is not covered in this article—involving the combination of multiple dielectric and conductive materials, is the subject of extensive research and development.
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