Basic principles
Surface treatments for microelectronics connections

A chip can be assembled and connected in a "system in package", on a substrate or on a board, in a number of different ways. Two techniques are the most widespread.

• Wired connection

  The wire bonding technique has been developed over many years. Once a chip has been positioned and glued to its future substrate, this technique enables the chip to be electrically connected by means of a wire soldered around its periphery (figure 1 ).

  More than 90% of electronic components are connected using this method, since automatic machines operating at very high speeds (>...