Production of fusible microbeads for soldering
Surface treatments for microelectronics connections

The terminal block must perform 4 functions:

• the electrical connection between the component to be assembled and its support;

• removal of heat dissipated by the chip;

• environmental protection ;

• structural bonding between chip and substrate.

The material and process selected have a direct impact on system performance. The table at 4 lists the most frequently used ball materials and their main characteristics: