Choice of manufacturing process
Surface treatments for microelectronics connections

In addition to the nature of the alloy to be produced, the choice of material manufacturing process is also conditioned by the size of the microbeads and the pitch of the future interconnections (probably the most important factors). Indeed, depending on whether you want to assemble a processor or an image sensor (several hundred interconnections, a few millimetres on a side and a small interconnection pitch) or a BGA package (a few inputs/outputs with a pitch of several hundred micrometres), the material processing method will differ (figure 14 ).

Most of these processes are "wafer level", meaning that several thousand electrical connections can be made simultaneously on the substrates. Depending on the case, it may be more advantageous to choose a collective (wafer...