Markets concerned
Rigid and flexible multiply packaging materials - Lamination and coextrusion
Article REF: AM3577 V2
Markets concerned
Rigid and flexible multiply packaging materials - Lamination and coextrusion

Authors : Pierre CHOMON, Bernard CHARNIER

Publication date: July 10, 2017 | Lire en français

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4. Markets concerned

4.1 Non-thermoformable flexible laminates

Whether "barrier O 2 " or not, these materials are used in the machine technologies covered in 3 and are produced either by :

  • glue assembly (C/C)...

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