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Article | REF: E3385 V2

Packaging of power module

Author: Raphaël RIVA

Publication date: December 10, 2020 | Lire en français

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1. 2D power module

The packaging of the power module is the close environment of the semiconductor chips. It must meet certain conditions to ensure the correct operation of the chips:

  • mechanical resistance: the packaging must protect the chip from moisture, dust and static electricity . It protects it mechanically by means of a cover,...

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