Wiring wire
Packaging of power module

Article REF: E3385 V2

Wiring wire
Packaging of power module

Author : Raphaël RIVA

Publication date: December 10, 2020 | Lire en français

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6. Wiring wire

The power module's internal electrical connections, on semiconductor chips in particular, are generally made using Wire Bonding technology. These are wiring wires with a diameter of between 100 and 500 μm (figure 20 a) . They are generally made either of aluminum,...

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Bibliography

Bibliography

(1) - MASSON (A.), SABBAH (W.), RIVA (R.), BUTTAY (C.), AZZOPARDI (S.), MOREL (H.), PLANSON (D.), MEURET (R.) - Die attach using silver sintering. Practical implementation and analysis. - European Journal of Electrical Engineering, vol. 16, n° 13-14, p. 293-305, août 2013.
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