Evaluation of junction temperature
Power semiconductors - Thermal problems (part 1)
Article REF: D3112 V1
Evaluation of junction temperature
Power semiconductors - Thermal problems (part 1)

Author : Jean-Marie DORKEL

Publication date: May 10, 2003 | Lire en français

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3. Evaluation of junction temperature

When it comes to calculating the temperature rise of power components and integrated circuits, the concept that is commonly used in power electronics and specified in specifications is junction temperature. However, this concept must be used with caution, and needs to be precisely defined if it is to be used correctly.

3.1 Practical definition of junction temperature

In an operationally-active power component or integrated circuit, the temperature is not uniform, as heat flow is essentially a three-dimensional process, as shown by the equations (1) and

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