Thermal environment of power components
Power semiconductors - Thermal problems (part 1)
Article REF: D3112 V1
Thermal environment of power components
Power semiconductors - Thermal problems (part 1)

Author : Jean-Marie DORKEL

Publication date: May 10, 2003 | Lire en français

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2. Thermal environment of power components

Whether it's a discrete component, a module or a power IC, the heart of the power semiconductor component is the silicon chip, which has been designed to perform a well-defined switching function. However, a component cannot be operational without the chip(s) being suitably mounted on a substrate, which in turn is encapsulated in a housing. This package is then mounted in a system which determines the thermal environmental conditions of the component. In the following, we'll refer to this thermal environment as a "radiator". It's the thermal behavior of the chip-housing-radiator assembly that needs to be studied when looking at power components.

2.1 Substrates, housings and radiators

Since the mid-1980s, with the development of hybrid integration techniques,...

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