Assembly methods for microwave tubes and devices

The components used in the manufacture of electronic systems, such as components, electronic tubes, etc., are made up of conductive or insulating materials (metals or various alloys, glass, ceramics) and special compounds (thermoelectronic or photoelectric emitters, for example). The combination of materials with such different properties calls for assembly methods specially adapted to the requirements of the electronics industry. Some of these assemblies act as envelopes, maintaining a well-defined gaseous atmosphere around the components' active elements:

• pressure $⩽$ 10 ^–7 Pa in most electronic tubes;

• pressure of 10 ^{– 4} at 10 Pa of neutral or reducing gases: argon, hydrogen, xenon, etc., in other types of electronic discharge tubes;

• protection against environmental influences for semi-conductors.

The aim of this article is to describe the assembly processes currently used in electronic component production. Certain processes specific to semiconductors and integrated circuits, which cannot be used in other industries, will not be discussed.